Description
Transparent Silicone Potting Compound for Electronics and Repairable Assemblies
STEP-KS1 is a transparent, two-component silicone potting compound designed for insulating and protecting electronic and electromechanical components. It can be used as a clear coating in thin layers or for encapsulating microchips, coils, electrical connectors and other assemblies exposed to environmental influences.
Its low application viscosity allows the compound to flow into narrow gaps and reproduce the geometry of the component or mould. It cures with minimal shrinkage. Where repair or rework is required, the cured material can be removed mechanically.
Key Benefits
- Transparent cured material.
- Low viscosity for filling small gaps and detailed geometries.
- Suitable for thin-layer transparent coating and potting.
- Mechanically removable to support repair and maintenance.
- Room-temperature cure, with an accelerated elevated-temperature option.
- Minimal curing shrinkage.
- Wide operating temperature range: -60°C to +200°C.
Typical Applications
- Encapsulation of microchips and electronic components.
- Potting of coils, electrical connectors and assemblies.
- Protective transparent coatings for electronic devices.
- Repairable devices used in electronics, instrumentation and mechanical engineering.
Technical Specifications
| Material | Two-component silicone |
|---|---|
| Mixed appearance | Clear, low-viscosity mass without foreign inclusions |
| Mixing ratio | 100:3.5 |
| Working time | At least 90 min at 20–25°C |
| Brookfield dynamic viscosity | 1,660 mPa·s |
| Technological cure | 12 h at 20–25°C |
| Cold cure schedule | 24 h at 15–35°C |
| Accelerated cure schedule | 4 h at 60–80°C |
| Operating temperature | -60°C to +200°C |
| Tensile strength | 0.25 MPa |
| Elongation at break | 85–95% |
| Thermal conductivity | ≥0.2 W/(m·K) |
| Hardness | 25 Shore A |
| Volume resistivity | 1.96 × 10¹⁵ Ω·cm |
| Density | 1.0 g/cm³ |
| Dielectric strength | ≥15 kV/mm |
| Removal | Mechanical removal with a cutting tool |
Application note: Confirm the mixing procedure, cure schedule and compatibility with the substrate using the manufacturer’s current technical documentation.
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