Description
Ultra-Soft Removable Silicone Potting for Serviceable Electronics
STEP-KS3 is a fast-curing, two-component silicone compound designed for potting electronic and radio-electronic equipment where future maintenance or component replacement is important. After curing, the exceptionally soft material helps protect components from moisture, contamination, impact, vibration and exposure to chemically active substances, while remaining removable.
The cured compound can be removed to provide access to components during repair. Its low-viscosity mixture supports potting applications, and the 10:1 mixing ratio is specified by the manufacturer.
Key Benefits
- Very low hardness: 0–4 Shore A.
- Fast curing: technological cure in approximately 60 minutes at 20–35°C.
- Low application viscosity.
- Removable design for repair and component replacement.
- Good dielectric characteristics.
- Suitable for electronic assemblies and high-voltage equipment.
- No corrosive effect on non-ferrous metals, according to the manufacturer.
- Operating temperature range: -60°C to +150°C.
Typical Applications
- Potting of electronic and radio-electronic equipment.
- Encapsulation of assemblies requiring periodic service.
- Protection of components exposed to moisture, dirt, vibration or impact.
- Electrical and high-voltage equipment, subject to application validation.
Technical Specifications
| Material | Two-component silicone |
|---|---|
| Mixing ratio | 10:1 |
| Mixed appearance | Low-viscosity liquid, white to light beige |
| Working time | 10–13 min at 20–23°C (fourfold viscosity increase) |
| Brookfield dynamic viscosity | 1,100–1,600 mPa·s |
| Technological cure | 60 min at 20–35°C |
| Cold cure schedule | 2–3 h at 15–35°C |
| Hardness | 0–4 Shore A |
| Tensile strength | 0.1–0.3 MPa |
| Dielectric loss tangent at 1 MHz | 0.005–0.010 |
| Relative permittivity at 1 MHz | 2.6–3.2 |
| Dielectric strength | 13–17 kV/mm |
| Operating temperature | -60°C to +150°C |
Important: Follow the manufacturer’s technical documentation for component mixing, processing and cure conditions. Validate performance in the intended assembly before production use.
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