STEP-S1 Transparent Repairable Silicone Potting Compound

Transparent, ultra-soft two-part silicone potting compound designed to protect electronic assemblies while keeping them accessible for repair and maintenance. Room-temperature addition-cure system with a 1:1 mixing ratio, Shore A hardness of 10, and an operating temperature range of -60°C to +150°C.

Description

Transparent Silicone Protection That Keeps Electronics Repairable

STEP-S1 is a two-component, transparent silicone potting compound developed for electronic assemblies that require reliable insulation and environmental protection without sacrificing serviceability. Its highly elastic, low-hardness cured material can help protect sensitive components while allowing repair or rework when required.

The compound cures at room temperature through an addition-cure process using a platinum catalyst. Its convenient 1:1 mixing ratio supports straightforward preparation and application.

Key Benefits

  • Transparent cured material for applications where component visibility matters.
  • Very soft elastomer: Shore A hardness 10.
  • Can help achieve protection up to IP68 when used in a properly designed and tested assembly.
  • Simple 1:1 component mixing ratio.
  • Wide operating temperature range: -60°C to +150°C.
  • Working time: approximately 70–90 minutes at 23°C.
  • No volatile substances released during curing, according to the manufacturer.
  • High dielectric performance for electrical and electronic applications.

Typical Applications

  • Potting and insulation of electronic assemblies.
  • Protection of electrical connections and sensitive components.
  • Repairable electronic modules requiring environmental protection.

Technical Specifications

Material Two-component silicone
Cure mechanism Addition cure (platinum catalyst)
Mixing ratio 1:1
Working time 70–90 min at 23°C
Brookfield dynamic viscosity 5,000–7,000 mPa·s
Technological cure 8–12 h at 20–25°C
Cold cure schedule 48 h at 20–25°C
Operating temperature -60°C to +150°C
Tensile strength 0.7–0.9 MPa
Elongation at break 280–310%
Hardness 10 Shore A
Volume resistivity ≥1.0 × 10¹³ Ω·cm
Dielectric strength 15 kV/mm
Dielectric loss tangent at 1 MHz 0.011

Application note: The manufacturer recommends using STEP-15 primer/undercoat to improve adhesion. Confirm compatibility and the required protection level through testing on the finished assembly.

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